CPU Repair Chip Removal

CPU Repair Chip Removal

DH-G200, also called DH-G600, which is designed for mobile phone, computer, laptop and Printer repairing, comparison to other models, it is a smaller weight and volume.

Popis

DH-G200 BGA rework station used for GPU repairing and CPU removal 


BGA (Ball Grid Array) rework stations are specialized equipment used to repair and 

rework circuit boards that use BGA components, such as CPUs, GPUs, and memory 

chips. These components are mounted on the board using an array of tiny solder balls, 

making them difficult to remove and replace without damaging the board or the com-

ponent itself.


BGA rework stations use a combination of heat, air-flow, and vacuum to remove and 

reflow solder balls, allowing the technician to remove and replace the BGA component. 

The rework station typically includes a heating element, a nozzle for directing hot air, 

and a vacuum mechanism to remove the component.


For GPU repair and CPU removal, BGA rework stations are crucial tools. GPUs and CPUs 

are some of the most complex and sensitive components on a circuit board, and they require 

advanced techniques to remove and replace them. With a BGA rework station, technicians can 

carefully heat the component to soften the solder, remove it from the board, and replace it with 

a new component without causing damage to the board or the chip.


Overall, BGA rework stations are essential tools for the electronics repair industry, and they allow

 technicians to perform complex repairs and rework with precision and consistency.




1. The machine illustration of BGA rework station for GPU repairing


cpu repair

DH-G200, also G600, which is a highly cost-effective model with split vision, application for 

CPU repair, GPU removal,MCM,4G,5G products rework.

CPU Repair

High-resolution monitor screen, which is very helpful when aligning, even though an 

operator can skilly finish the reworking process. 


DH-G600


Simply operating steps for soldering and desoldering, customized nozzles for MCM, 4G,5G 

and other motherboards.

Touch screen of BGA machine

The movable drawer, which saves space and makes itself protected, PID installed for temperature and 

time calculation accurately. 



2. The parameters of DH-G200 rework station for CPU removal 



Total Power

5300W

Top heater

W1200


Bottom heater

The 2nd heating zone: 1200W 

The preheating zone: 2700W


power

AC220V±10%     50/60Hz


Dimensions

L550×W580×H720 mm


Positioning

"V" groove, and X/Y movable


Temperature control

K-type Sensor, Closed-loop


Temp accuracy

±2 °


Position accuracy

0.01mm


PCB size

Max 380×400 mm   Min 10×10 mm


BGA chip

2X2-80X80mm


Minimum chip spacing

0.02mm


External Temperature Sensor

1 pcs(optional , for more)


64Net weight

64kg




3. Packing and shipping


Using wood bars and cloth-belt fixed, which can make the machine will not be movable

packing for CPU repair machinepacking for CPU repair machine

It can be shipped by DHL, TNT, FEDEX and other special lines.


4. Warranty and payment

At least one year for the whole machine, if having any problem when using, and need new spare parts, which can be provided free. 


If massive quantity and normal standard, 30% deposit for machines prepared, 70% paid before delivery.

If customize,  50% paid for machines prepared, 50% paid before delivery.


5. Why we choose yours?

We are the No. 1 in China, Huawei, Google, Foxconn and Mitsubishi are using our equipment. 


We are a factory which can design and manufacture.


We positively work in with all of our customers. 




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